📖 3D Stacked Chips
Monday, November 12, 2018 by dev
3D Stacked Chips
By:Ibrahim (Abe) M. Elfadel,Gerhard Fettweis
Published on 2016-05-11 by Springer
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
This Book was ranked at 29 by Google Books for keyword chip.
Book ID of 3D Stacked Chips's Books is QqMqDAAAQBAJ, Book which was written byIbrahim (Abe) M. Elfadel,Gerhard Fettweishave ETAG "dLxhG0Rakyo"
Book which was published by Springer since 2016-05-11 have ISBNs, ISBN 13 Code is 9783319204819 and ISBN 10 Code is 3319204815
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Book which have "339 Pages" is Printed at BOOK under CategoryTechnology and Engineering
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