📖 Area Array Packaging Processes
Saturday, November 3, 2018 by dev
Area Array Packaging Processes
By:Ken Gilleo
Published on 2004 by McGraw Hill Professional
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
This Book was ranked at 15 by Google Books for keyword chip.
Book ID of Area Array Packaging Processes's Books is k_2qLoLA_tgC, Book which was written byKen Gilleohave ETAG "zC5kGNafak8"
Book which was published by McGraw Hill Professional since 2004 have ISBNs, ISBN 13 Code is 9780071428293 and ISBN 10 Code is 0071428291
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Book which have "260 Pages" is Printed at BOOK under CategoryTechnology and Engineering
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