📖 Reflow Soldering Processes and Troubleshooting
Friday, October 5, 2018 by dev
Reflow Soldering Processes and Troubleshooting
By:Ning-Cheng Lee
Published on 2002-01 by Newnes
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
This Book was ranked at 15 by Google Books for keyword chip.
Book ID of Reflow Soldering Processes and Troubleshooting's Books is 6wpNZquo-YQC, Book which was written byNing-Cheng Leehave ETAG "ZpkCbpBz59o"
Book which was published by Newnes since 2002-01 have ISBNs, ISBN 13 Code is 9780750672184 and ISBN 10 Code is 0750672188
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Book which have "270 Pages" is Printed at BOOK under CategoryTechnology and Engineering
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