📖 Flip Chip Technologies
Thursday, July 26, 2018 by dev
Flip Chip Technologies
By:John H. Lau
Published on 1996 by McGraw-Hill Professional Publishing
'Flip Chip' has come to describe a group of related technologies that are used for connecting a chip to a substrate without the use of wires. Instead of using traditional wire leads, the chip is literally placed upside down, lying directly upon the substrate. This is the first book on this topic, a comprehensive reference that covers the design, engineering, and manufacturing of these packages.
This Book was ranked at 11 by Google Books for keyword chip.
Book ID of Flip Chip Technologies's Books is oBhTAAAAMAAJ, Book which was written byJohn H. Lauhave ETAG "ssHp9rusu7U"
Book which was published by McGraw-Hill Professional Publishing since 1996 have ISBNs, ISBN 13 Code is 9780070366091 and ISBN 10 Code is 0070366098
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Book which have "565 Pages" is Printed at BOOK under CategoryTechnology and Engineering
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