📖 Advanced Flip Chip Packaging
Friday, August 31, 2018 by dev
Advanced Flip Chip Packaging
By:Tong Ho-Ming,Yi-Shao Lai,C.P. Wong
Published on 2013-03-20 by Springer Science & Business Media
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
This Book was ranked at 35 by Google Books for keyword chip.
Book ID of Advanced Flip Chip Packaging's Books is 3YBDAAAAQBAJ, Book which was written byTong Ho-Ming,Yi-Shao Lai,C.P. Wonghave ETAG "CmgEBwf/1R8"
Book which was published by Springer Science & Business Media since 2013-03-20 have ISBNs, ISBN 13 Code is 9781441957689 and ISBN 10 Code is 1441957685
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Book which have "560 Pages" is Printed at BOOK under CategoryTechnology and Engineering
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